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Diamond Dicing Blade.Nickel Bond (electroformed) Hubless Diamond / CBN Dicing Blades

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Diamond Dicing Blade.Nickel Bond (electroformed) Hubless Diamond / CBN Dicing Blades

Brand Name : more

Model Number : 1A1R

Certification : ISO9001

Place of Origin : china

MOQ : 1

Price : charge

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 4000

Delivery Time : 5-7days

Packaging Details : box

material : diamond

bond : Resin metal

usage : wafer

color : black

factory : yes

Dia : 175 200

Hole : 31.75 40

wide : 5 3

Grit : all

email : anna.wang@moresuperhard.com

whatsapp : 008615617785923

finishing : yes

body : wafer

price : Price can be negotiated

Contact Now

Diamond Dicing Blade

Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)

Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter

Electronic parts, Optical devices, semiconductor packages, BGA, CSP

Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon

SELECTING RIGHT DIAMOND DICING BLADE FOR YOUR APPLICATION


Selecting the right diamond dicing blade & parameters for your material/application can be a very time consuming, trial & error frustrating process. The guide below has been designed to help you better understand the most important diamond blade variables, which will play a major role in performance, cutting speed, and surface finish of your dicing blade

Diamond Dicing Blades

Types:

According to the structure, it can be divided into the soft blade and hard blade. Generally, the circular sheet grinding wheel is called “soft blade” and the combination of the grinding wheel and the aluminum alloy tool holder is called “hard blade”.

According to bond, it is divided into metal bond, resin bond, electroplated bond diamond dicing blade.


DRAWING&SPECIFICATION

Diamond Dicing Blades

Electroformed dicing blade

Features:

Easy to handle;

Variety of different grit concentrations;

Stable processing performance


Hub dicing blade

Application: Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)

Diamond Dicing Blades


Resin bond dicing blade

Features:

High processing quality for cutting of hard, brittle materials;

Improved cut quality on hard materials


Hubless dicing

blade

Application:Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter

Diamond Dicing Blades

Metal bond dicing balde

Features:

High rigidity minimized wavy&slant cutting;

Excellent rigidity and cut quality

Application: Electronic parts, Optical devices, semiconductor packages, BGA, CSP,

Diamond Dicing Blades

Electroformed dicing balde

Features:

Wide selection of blade options

Proprietary thin-blade technology

Blade thickness - 0.015 mm to 0.3 mm

Available for both dicing saws and slicers

Application: Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon
Other specification can be produced according to customer’s requirements

Metal bond and resin bond soft blades:

Metal bond diamond dicing blades (soft blades) have high strength, good rigidity, long life, mainly used in BGA, CSP, optical, sapphire, and etc.

Resin bond diamond dicing blades(soft blades) has good elasticity, self-sharpening, sharp cutting, good cutting quality, and can be used in hard and brittle materials, IR filter, optical, QFN, splitter, and etc.

1a8-a diamond dicing blade

1a8-2 diamond dicing blade

Metal Bond

diamond-dicing-blade

Resin Bond

diamond-dicing-blade-table

Electroplated bond soft and hard blades:

Electroplated bond diamond dicing blades (soft blades) feature high strength, good rigidity, good shape retention and long service life. They can be used in ceramics, magnetic materials, PCB, silicon, etc.

Electroplated bond diamond dicing blades (hard blades) feature high precision and long life. They can be used in silicon and compound semiconductor wafers.

Electroplated-bond-soft-and-hard-blades

Diamond-Dicing-Blade 1

Compared with Disco and K&S

Thickness Comparison

We supply the thinnest dicing blade that can be 16-20μm, thickness and tolerance ranges are correspondence with range and Disco and K&S.

NZDISCO, NBC, ZH05DISCO, ZHZZK&S
Thickness(μm)Tolerance Range(μm)Slot Width(mm)Slot Width(mm)Max Kerf:25μm
2016-20A 0.015-0.020Z 0.010-0.01515-200.6-0.8
2521-25B 0.020-0.025A 0.015-0.02021-250.8-1.0
3026-30C 0.025-0.030B 0.020-0.02526-301.0-1.2
3531-35D 0.030-0.03531-361.2-1.4
4036-40E 0.035-0.04037-411.4-1.6
5041-50F 0.040-0.05042-511.6-2.0
6051-60G 0.050-0.06052-642.0-2.5
7061-70H 0.060-0.07065-762.5-3.0
8071-80I 0.070-0.08077-893.0-3.5
9081-90J 0.080-0.09090-1023.5-4.0
K 0.090-0.100103-1144.0-4.5
115-1274.5-5.0
128-1405.0-5.5

Exposure Comparison

The exposures of NZ dicing blades correspond to DISCO and K&S. At the same time, the exposures and the thickness ratio are controlled to be less than 33, ensuring the strength of the blade and avoiding oblique cutting and serpentine cutting path.

NZExposure(μm))3805106407608901020
Tolerance Range(μm)380-510510-640640-760760-890890-10201020-1150
DISCOExposureABCDEF
mm0.38-0.510.51-0.640.64-0.760.76-0.890.89-1.021.02-1.15
K&Smm.381-.507.508-.634.635-.761.762-.888.889-1.0151.016-1.142
mils15-2020-2525-3030-3535-4040-45

Diamond Grit Comparison

It is very important for diamond grit size subdivision. The finer grit size can reduce the front chipping, the coarser grit size can reduce the back chipping. Higher feed speed can improve the cutting life.The diamond grit size of DISCO blade is divided into 11 kinds, that of K&S blade is divided into 7 kinds, and that of NZ blade is subdivided into 11 kinds, which corresponds to DISCO completely.

NZDISCOK&S
Diamond Grit SizeDiamond Grit SizeDiamond Grit Size

5000#, 4500#

4000#, 3500#

3000#, 2500#

2000#, 1800#

1700#, 1500#

#1500, #1700, #1800,

#2000, # 2500, #3000,

#3500, #4000, #4500,

#4800, #5000

G*, F 2-4μm

J*, K 2-6μm

Q*, S 4-6μm

U 4-8μm

Diamond Concentration Comparison

The higher diamond concentration can increase the cutting life, and the lower concentration can reduce the back side chipping. The concentration of DISCO blade can be divided into 5 kinds. There are only 3 kinds of diamond concentration of K&S blade. The concentration of NZ dicing blade can be sub divided into 5 kinds corresponding to DISCO.

NZDISCOK&S
Diamond ConcentrationDiamond ConcentrationDiamond Concentration

50

70

90

110

130

50

70

90

110

130

Super Low

Low

Standard

Bond Hardness Comparison

NZDISCOK&S
Bond HardnessBond HardnessBond Hardness

S Soft Bond

M Middle Bond

H Hard Bond

O Standard

J Soft

F Chipping

E Soft

Q Standard

V Hard


China Diamond Dicing Blade.Nickel Bond (electroformed) Hubless Diamond / CBN Dicing Blades wholesale

Diamond Dicing Blade.Nickel Bond (electroformed) Hubless Diamond / CBN Dicing Blades Images

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